Clean Energy

Power generation is a leading cause of air pollution globally. Renewable energy resources like wind, water and solar power generate electricity with little or no pollution are reliably available and affordably provide a large portion of our needed electricity.

FASA has been constantly seeking new technological breakthroughs and innovations over the years to provide better systems and solutions to customers while cutting down costs. We have conceived, developed, designed, and successfully realized the next-generation Silicon Ingot Wire-Saw Equipment, which is used in the Solar Industry for slicing of ingots into wafers. The result is a brand new system that can slice silicon ingots into ultra-thin wafers so as to significantly reduce the total cost of solar photovoltaic (PV) panel manufacturing.



DWS-1336 Diamond Wire Wafering Saw

Incorporates patented technologies and methodologies in order to significantly reduce the total cost of silicon wafer manufacturing for solar industry. It is a dedicated diamond wire wafering system and makes use of diamond wire to slice silicon ingots. The system, therefore, completely eliminates the use of slurry and is environmentally friendly. It is a proven system and is able to produce wafers at a high throughput and high yield with consistent quality.

Product: Ingot
Handling: Wire Wind and Unwind, Coolant, Wire clean
Function: Ingot Slicing




For more information or request brochure on our products or services, please contact us.