Semiconductors

The rising demand for smart devices, wireless communication infrastructure, internet connected devices is boosting the semiconductor production equipment market. FASA serves global semiconductor manufacturer by providing them major semiconductor processing equipment such as assembly and packaging equipment, wafer processing & testing equipment and more.

FASA’s extensive experience in providing manufacturing solution to semiconductor industry have developed a wide range of technology to cater to your unique manufacturing requirements. We offer flexible manufacturing system that is designed to be adaptable to the changes in the product which provides manufacturers an advantage in a rapidly changing manufacturing environment. It Includes Flexible Testing and Burn-in systems to determine your components reliability and eliminate defective components before they are integrated into larger systems.

We have successfully built and developed over a hundred of customized systems capable of processing and testing semiconductor Packages, IC chips, Wafers, Subtrates, Lead Frames and others.


LEAD FRAME PROCESSING SYSTEMS

Adhesive/ Silicon/ Kapton Dispensing, Die Inspection, Bonding, Laser Welding, Laser Marking and more.




WAFER & DIE PROCESSING SYSTEMS

Burn-in Testing, Multi Stack Die processing, Thermal Compression Bonding, 2D Marking and more.




IC PACKAGES & DEVICES PROCESSING SYSTEMS

Testing, Laser Marking, Sorting, Packing and more.




For more information on our products or services, please contact us.