Semiconductors

Saw Singulation System

Saw Singulation System to perform accurate dicing of advanced array packages. Patented design incorporating Twin Spindles Actuator Mechanism. Cutting is achieved in both forward and reverse motions of the substrate on two separate precision guides, with concurrent loading/ unloading and vision inspection and alignment, resulting in more than 40% to 50% improvement in throughput.

Process and Testing Equipment.

Lead Frame Handler and Dispensing Equipment; Laser Welding, and Vision Inspection including equipment for Ultra High-Precision applications, with sub-micron accuracy.

Lead-frame handling machine with dispensing, bending, placement and laser welding.

System developed to accurately carry out laser marking on components, with auto loading & unloading.

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